In the use of solder paste is to pay attention to the following requirements: 1. After the solder paste is purchased, write the number for each can of solder paste. 2, in the form of sealed storage in the constant temperature and humidity of the refrigera
The quality of component package will directly affect the performance of chip itself and PCB design and manufacture connected with it.
By shortening construction time and compressing work-in-process retention.Difficulty is the ladder of success, the success of the process is reasonable, reasonable, reasonable.
The fact that there are few restrictions on where components can be placed and no "infallible" rules doesn't mean you can do whatever you want.
Engineering software and online resources tend to be expensive, but can be very beneficial for professionals, students, and hobbyists.
Normally speaking, if the protection and raw material procurement in accordance with national standards, solder will not cause significant harm. Now it's basically lead-free products.
In the design of PCB, I found that many people do not understand the layers of PCB, each layer has the characteristics of each layer, function.
When looking for faulty capacitors, it is important to check the capacitors close to the heat source, such as the capacitors near the heat sink and high-power components. The closer to the capacitors, the greater the possibility of damage.
With the development of miniaturization of electronic products and high-density assembly of circuit board components, SMT production and testing have brought great challenges.
Through hole is one of the important components of multi-layer PCB. From the perspective of function, through hole can be divided into two categories: one is the electrical connection between each layer; The second is the device fixing or positioning.
On the automatic surface mounting line, if the PCB is not smooth, it will cause inaccurate positioning, components cannot be inserted or affixed to the holes of the board and the surface mounting pad, and even crash the automatic inserting machine.
PCB deformation causes can be divided into thermal stress and mechanical stress. The thermal stress is mainly produced in the process of pressing, and the mechanical stress is mainly produced in the process of stacking, handling and baking.
