What are the main difficulties in making multilayer PCB board
Traditionally, we define PCB boards with more than 4 layers as "multilayer PCB boards", and more than 10 layers as "high multilayer PCB boards".
Traditionally, we define PCB boards with more than 4 layers as "multilayer PCB boards", and more than 10 layers as "high multilayer PCB boards".
There will be engineering review and approval of your information, if there is a problem with the first time to combine with you! In order not to delay your time, the combination of the form must be accurate, if not combined, we will stop production!
It is easy to determine that the IC is damaged. These changes are not necessarily caused by the IC damage, nor do they necessarily indicate that the IC is good. Because some soft faults do not cause a change in DC voltage.
Width and spacing of printed wire are important design parameters, which affect not only the electrical performance and electromagnetic compatibility of PCB, but also the manufacturability and reliability of PCB.
Only each module has good EMC and low EMI can ensure the realization of the whole system function.
Because the wider the printed line is, the smaller the inductance is, the lead line from the pad to the hole should be widened as far as possible, and the width of the pad should be the same as far as possible. In this way, even the capacitance of 0402 pa
PCB copy board process some small principles :1, printed wire width selection basis: 2, line spacing: 3, pad: 4, draw circuit frame: 5, component layout principle: 6, input signal processing unit, 7, component placement direction: 8, component spacing. 9.
The key factors of PCBA crimping technology are as follows: (1) crimping end; ② Printed board; ③ crimping process; (4) Crimping tools and equipment
In order to meet customer requirements, the circuit board must plug holes through the hole, after a lot of practice, change the traditional aluminum sheet plug process, with white mesh to complete the circuit board surface welding and plug holes.
General circuit board production will be carried out board work, its purpose is to increase the production efficiency of SMT production line.
According to the activity of flux, it can be divided into active (RA), medium active (RMA), inactive (R), water washing (OA), no cleaning (NC)
5 PCBA processing automation production of PCB size, shape, transmission edge, positioning hole, positioning symbol requirements.