The physical treatment of waste PCB mainly includes mechanical crushing, air separation, magnetic adsorption and other technologies; Chemical method is divided into pyrometallurgy, hydrometallurgy and so on.
To summarize, the production process of a typical pcb factory is as follows: blanking → inner fabrication → pressing → drilling → copper plating → outer fabrication → soldering paint printing → text printing → surface treatment → contour processing.
In 1936 a radio was built with a printed circuit board. In 1943, PCBS were widely used in military radios. In 1948, PCBS were officially approved for commercial use. On June 21, 1950, Paul Essler was granted a patent for his invention.
The milling technology of circuit board CNC milling machine includes the selection of cutting direction, compensation method, positioning method, frame structure, the next cutter point, which is an important aspect to ensure the milling precision.
Five common silver plating defects of multilayer circuit boards have been solved by solution manufacturers, equipment manufacturers and PCB factories, and some methods have been found to prevent and improve them.
The number of layers of the multilayer board is not limited, there are more than 100 layers. Relatively speaking, PCB with even layers does have more advantages than PCB with odd layers.
In the PCB industry using laser marking two-dimensional code technology, can realize PCB production, process, quality traceability, and realize the automation, intelligent management requirements.
No cleaning means that the residues of PCB circuit boards are safe from the chemical point of view, will not have any impact on the production line of PCB circuit boards, and can be left on PCB circuit boards
In PCBA processing, there are several process points in the whole process of rework and reflow: 1. Repair reflow welding curve should be close to the original welding curve. 2. In the reflux process, the heating temperature and time of each area should be
The following factors should be considered in the processing of PCBA capacitor components: first, the selection of capacitor voltage resistance, second, capacitance selection, third, capacitor medium selection,
Prevention can be carried out in the following ways: 1, moisture-proof storage of components, 2, choose well-known brand solder paste, 3, adjust printing parameters, 4, adjust reflow temperature curve, 5, try to use reflow welding, reduce manual welding,
The following operations will be carried out in the maintenance technology: 1, inspection of components, 2, welding state analysis, 3, detection of components direction, 4, tool inspection of components, 5, power-on test
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