Pay attention to the wiring of signal lines under the magnetic beads, between the pads and those that may come into contact with the magnetic beads. Some magnetic beads conduct electricity quite well and may produce unexpected conductive paths.
Ensure the machining accuracy and assembly accuracy of guide column and guide sleeve; Reduce the fit gap between the shape of pusher plate and the die, and make the shape of pusher plate consistent with the concave and convex shape.
Only under certain conditions can the 20H principle have obvious effects. 1. The power plane shall be located inside the PCB, and the upper and lower layers adjacent to it shall be 0V planes, and the distance between the two 0V planes shall be at least 20
Common bad reasons for PCBA welding resistance film processing :1. Welding pad and through hole connection. 2. Solder resistance design between pad and pad, solder resistance graphic specifications should conform to the design of welding end distribution
The difference between them is that the core is thinner, the pp sheets of one or two layers and five or six layers are thinner, and there is a core board between the core board and the core board without copper foil on both sides, so generally this kind o
The characteristics of the gold process: the copper on the circuit board is mainly copper, copper solder in the air is easy to be oxidized, which will cause the electrical conductivity is to eat tin bad or bad contact, reduce the performance of the circui
The function of PCB design discharge teeth: in surge testing or ESD testing, the two ends of the common-mode inductor will produce high voltage, there will be a flying arc, if the distance is close to the surrounding devices, it may cause damage to the su
The role of PCB process edge: process edge is the part added on both sides or four sides of PCB board, mainly to assist the patch plug-in welding plate
PCB board common bad reasons: 1, short circuit, 2, open circuit, 3, PCB board dark and granular contact, 4, PCB board solder joint into golden yellow, 5, environmental impact
Common heat dissipation mode of circuit board: 1, high heating device plus radiator, heat conduction plate, 2, through the circuit board itself heat dissipation, 3, the use of reasonable design to achieve heat dissipation function, 4, for the use of free
Soft and hard combined board PCB design points: 1, flexible area line design requirements, 2, dimensional stability, 3, covering film window design, 4, rigid flexible transition zone design, 5, flexible zone design with air-gap requirements
The application of wave-crest welding technology and reflow welding technology are completely different in component layout design, PCB and pad graphic design and hole design.
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