Detailed the copper sinking process of PCB board production and processing
The post-process can only be screened probabilistic through destructive experiments, and it is impossible to effectively analyze and monitor a single PCB board.
The post-process can only be screened probabilistic through destructive experiments, and it is impossible to effectively analyze and monitor a single PCB board.
This battery, this battery, that battery, unfortunately, has not yet been mass-produced on the road, and there are several experimental bus routes in use.
many times if the site sorting, rectification and other work to do, then some of the existing quality problems will improve a lot.
In the process of PCB board copying, since the circuit board needs to be split, the integrated circuit and other components are removed to make BOM list, and the bare PCB board is scanned and copied.
The platen method of this new concept is called "mass platen" or "large platen". In recent years, there have been many professional OEM pressing industry.
Halogen-free PCB printed circuit boards have low water absorption and meet the requirements of environmental protection, in other performance can also meet the quality requirements of PCB board.
Based on many years of actual production experience and service experience, the author now makes a brief analysis of the causes of bubbling on the copper plating surface of the circuit board.
Many factors affect the quality of PCBA quality, including human, machine, material factors, technological factors, environmental factors, etc. The quality of pcba process is mainly affected by the following conditions.
In the actual study, it is found that PCB design mainly has four aspects of interference: power supply noise, transmission line interference, coupling and electromagnetic interference (EMI).
In the design of PCB electromagnetic compatibility, the main problem that needs attention is the interference problem of power supply and ground.
In the process of PCBA production, the selection of PCBA transtin is also very important. In the process of through hole plug-in, tin penetration is not good, which is easy to cause problems such as virtual welding, tin cracking and even falling parts.
The content of PCB incoming material inspection includes PCB size and appearance inspection, PCB warping and distortion detection, PCB weldability test, PCB solder resistance film integrity test, PCB internal defect detection.