PCB surface treatment method
There are many PCB surface treatment processes, the common ones are hot air leveling, organic coating, electroless nickel plating, gold dipping, silver dipping and tin dipping.
There are many PCB surface treatment processes, the common ones are hot air leveling, organic coating, electroless nickel plating, gold dipping, silver dipping and tin dipping.
At present, no matter what kind of etching fluid is used, high pressure spray must be used, and in order to obtain a cleaner line side and high quality etching effect, the nozzle structure and spray mode must be strictly selected.
Needless to say, the PCB industry is facing increasing challenges and competition. But in trouble, lying flat can not save themselves, only fight, can be reversed.
This type of graphic plating is characterized by the presence of a copper coating only under the lead tin resist layer. Alternatively, the entire plate is coated with copper, with only tin or lead-tin resist outside the film
PCB circuit opening and short circuit are problems encountered by PCB manufacturers almost every day, so pcb manufacturers should pay attention to production and avoid short circuit problems
In this way, the printed circuit or printed circuit of the finished board called printed circuit board, also known as printed board or printed circuit board.
In order to understand PCB, it is necessary to understand the production process of usually single-sided, double-sided printed circuit board and ordinary multilayer board, in order to deepen the understanding of it.
Buried, blind hole structure of the printed circuit board, generally use the "sub-board" production mode to complete, which means that after several times of pressing plate, drilling, hole plating and so on to complete, so precise positioning is...
In high speed PCB, RF energy is usually coupled between the power plane and the ground plane to become the edge flux leakage.
There are many kinds and numbers of holes and complex shapes of single-sided paper substrate and double-sided non-metallic holes of epoxy glass cloth substrate.
It is a short name for dynamicviscosity. The viscosity is generally expressed in terms of the shear stress of the fluid flow divided by the velocity gradient in the direction of the flow layer in international units of Pa/s (Pa). S) or millipa/second (mPa
That is, on the copper foil part of the outer layer of the board to be retained, that is, on the graphic part of the circuit, a layer of lead tin corrosion resistance layer is pre-plated, and then the rest of the copper foil is etched away by chemical mea