PCB ink quality is excellent, in principle can not be separated from the combination of the above major components. Ink quality is excellent, is the formula of science, advanced and environmental protection of the comprehensive embodiment.
This paper introduces various techniques of the three types of interconnect design, including device installation methods, wiring isolation and measures to reduce lead inductance.
In order to alleviate this design pressure, communication chip manufacturers have to choose to develop higher speed IC products to meet the needs of large capacity and small volume products.
The production process of high frequency and high speed PCB board is basically the same as that of ordinary PCB board.
The reasonable selection of printed board size can make full use of the intermediate layer to set the shield, realize the nearby grounding better, reduce the parasitic inductance and shorten the transmission length of the signal.
A standard PCB looks something like this. Bare Board (with no parts attached) is also often referred to as a "Printed Wiring Board (PWB)".
The development level of printed circuit board industry can reflect the development speed and technical level of electronic industry in a country or region to some extent.
PCB board selection must meet the design requirements, mass production, cost balance. In short, the design requirements include both electrical and structural reliability.
No matter what work you are engaged in in the circuit board industry, if the circuit principle of electronic products is clear, you can improve the efficiency of functional testing and production efficiency of products. A trick takes you to understand the
The choice of surface treatment process mainly depends on the type of final assembly components; The surface treatment process will affect the production, assembly and final use of PCB board.
communication backplane, automotive board and other fields is relatively slow, while the HDI board, packaging board and soft board applied in high-end mobile phones, laptops and other "thin and short" electronic products will maintain rapid grow...
scheme selection, circuit design, circuit board design, structure design, component selection, production process, etc
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