The severe shrinkage of PCB parts after the transfer of the outer pattern caused by the poor dimensional stability of PCB substrates in individual batches can only be detected by the measurement of the outer pattern production first plate or during the sh
PCB stacking PCB design principles. The most efficient way to stack boards is to arrange the main ground (the main ground) in the second layer below the surface, and to arrange RF lines on the surface as much as possible.
Under normal circumstances, for the circuit below the microwave frequency band (including low frequency and low frequency digital circuit), careful planning under the premise of a comprehensive grasp of various PCB design principles is the guarantee of on
The relevant design elements constituting the PCB shall be described in the design drawing. Appearance should be represented by Mechanical 1 layer (priority) or Keep out layer.
Whether the size of the printed board is consistent with the size of the processing drawings, whether it meets the requirements of the PCB manufacturing process, and whether there is a behavior mark.
In order to facilitate the installation and maintenance of the circuit, the required logo pattern and text code are printed on the upper and lower surfaces of the printing board, such as component label and nominal value, component outline shape and manuf
ENIG surface treatment circuit board is one of the biggest advantages of the circuit board production and manufacturing process is simple, in principle only need to use two kinds of chemical potion (electroless nickel plating and acid gold water) can be c
The center of gravity of the entire board should be close to the geometric center of the PCB. The center of gravity should not be allowed to drift to the edge of the board (1/4 area).
In general, the direction of wave soldering on the printed circuit board should be parallel to the long side of the printed circuit board and perpendicular to the short side of the printed circuit board.
The two long edges of PCB should be parallel, and the non-parallel edges should be added to facilitate the equipment transmission in the production and processing process.
Now the installation is mechanized, the hole position of the circuit board and the deformation error of the circuit and the design should be within the allowable range.
In this PCB example, a hot pad has been used -- manually creating arcs and lines, see Pad 1 of J6 for details.
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