Adjacent to these connection points, a pad or mounting hole for mounting is placed between the case ground and the circuit ground. These ground connections can be cut open with a blade to keep the circuit open, or a jump with a magnetic bead/high frequenc
In the design of PCB routing, the input and output wires should avoid crossing as far as possible, and the feedback coupling can be avoided by adding capacitance between the wires.
All kinds of reliability design in digital circuit application is related to the reliability requirements of the circuit in practical application and product engineering requirements, so it is not possible to add various kinds of high-cost "guarantee...
The basic concept of microstrip theory and the concept of microwave RF circuit and PCB design is actually an application aspect of microwave double transmission line theory.
When multiple different boards are drawn in one file and want to split the delivery, please draw a border for each board in layer Mech1 with a space of 100mil between the boards.
Power part and control part separate layout, power circuit is generally large voltage, large current, high power circuit, relatively large interference. And the control circuit is low voltage, if the control part to the power part, the control part is ver
In addition, it is important to have the signal layer adjacent to the loop layer, that is, the board layout is signal, ground, signal, signal, power, ground, signal, signal, signal, signal.
In the case of the IC on our circuit board, the power layer around the IC can be regarded as a good high-frequency capacitor, which can collect the energy leaked by discrete capacitors that provide high frequency energy for clean output.
In addition, whether the need for special treatment, such as copper foil, shielding, etc., also need to be considered in the PCB design stage.
In fact, the biggest source of stress in Reflow process is "temperature", which not only makes the circuit board soft, but also distorts the circuit board. This, coupled with the material properties of "thermal expansion and cold contractio...
When the PCB wiring width changes, it should be carefully analyzed according to the actual situation to determine whether it will cause any impact. There are three parameters to be concerned about: how much impedance change, how much signal rise time, and
the Tg value will decrease after baking PCB is also a problem. A better method is to control the water absorption conditions from the selection of PCB board and the manufacturing process.
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