PCB board drawing design is a complex and simple process. For the same circuit or the same instrument, even if the circuit with exactly the same components and parameters, the result may be very different due to the different component layout design and e
Introduction of nickel electroplating process for printed circuit board PCBPCB (English PrintedCircuieBoard printed circuit board is short for) with nickel plating as the substrate coating of precious metals and base metals, for some single-sided printed
In the input and input circuits of the LED switching power supply, each circuit is composed of three main components, which are filter capacitor, power switch or rectifier, inductor or transformer.
Methods to resolve printing errors in the repair process: 1. Printing speed, 2. Printing method, 3. Scraper type, 4. Scraper adjustment
Solder joint as a direct result of welding, its quality and reliability determine the quality of electronic products. That is to say, in the production process, the quality of assembly is ultimately reflected in the quality of welding.
Product quality improvement Due to the small size and strong function of chip integrated circuit, one chip integrated circuit can realize the functions of several THT circuits on the SMT circuit board, so the probability of failure of the circuit board is
The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage, and determines the packaging form and structure of the surface assembled components in the SMT design stage accord
Package of integrated circuits in which the input and output points are tin balls arranged in a grid pattern on the underside of the component.
Analysis of the causes of holes (bubbles) in solder joints in PCBA patch processing: 1, the influence of flux activity, 2, related to the oxidation degree of PCB pad, 3, the influence of solvent boiling point, 4, related to the welding time, 5, the solder
Pin tin absorption can also be reduced by a flux with a slower wetting rate and a higher active temperature, or by a solder paste with different proportions of Sn/Pb to block melting.
SMT SMT processing includes the following equipment: 1, board machine: 2, solder paste printing machine, 3, SPI(3D solder paste detector) : 4, SMT machine, 5, the first piece of detector: 6, reflow welding, 7, plate machine: 8, AOI detection, 9, X-Ray
Key points of solder paste printing technology: 1, the Angle of the printing press scraper and steel mesh, 2, scraper pressure, 3, scraper speed, 4, printing gap, 5, release speed
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