What inspection should be done before SMT patch processing?
What inspection should be done before SMT patch processing: first, SMT patch components inspection, second, printed circuit board (PCB) inspection, third, SMT patch processing precautions
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SMT patch processing causes of virtual welding
The reasons for virtual welding in SMT patch processing are: (1) Virtual welding caused by SMT process factors; (2) Virtual welding caused by PCB factors; (3) Virtual welding caused by component factors; (4) Virtual welding caused by SMT equipment factors
This paper summarizes the packaging problems prone to occur in SMT patch processing
Reflow welding may have some effects on SMT machining quality: 1. PCB deformation caused by temperature gradient; 2. Component damage caused by temperature gradient, 3. Oxidation in reflow welding process
Factors affecting SMT patch processing straight through rate
There are five technological means to improve the pass-through rate: (1) optimize the design of steel mesh, (2) select the appropriate solder paste, (3) optimize the printing operation, (4) optimize the temperature curve, (5) adopt tooling and improve the
SMT patch processing how to achieve efficient refueling?
Polarity means that the positive and negative electrodes or first pins of a component are in the same direction as the positive and negative electrodes or first pins on the PCB(printed circuit board). If the component does not match the direction on the P
What problems should be considered in mass SMT patch processing?
This paper introduces the inspection requirements of PCBA processed products: 1. Inspection requirements of PCBA processed products; 2. Quality requirements of component mounting process; 3
What problems should be considered in mass SMT patch processing?
Shenzhen kingford is a PCBA processing manufacturer with more than 20 years of experience in PCBA processing. We have our own SMT processing plant, which can undertake mass SMT SMT processing services. Next, we will introduce what problems need to be cons
Common causes and solutions of material loss in SMT patch processing
Common causes of material loss in SMT patch processing: 1, human factors, 2, machine factors, 3, material reasons, 4, working methods, 5, production environment
The types and functions of SMT patch processing materials
Types of SMT SMT process materials: (1) solder and solder paste, (2) flux, (3) binder, (4) cleaning agent
The difference and connection of solder paste, solder paste and solder paste in SMT patch processing
Solder paste, solder paste, and solder paste are two kinds of products - solder paste and solder paste, solder paste and solder paste can be distinguished from the appearance of color, solder paste is yellow, solder paste will hair gray or black, this is
The role of AOI in SMT patch processing
What aspects of PCB have an impact on PCBA: one, PCB board surface dirty, two, white slag, three, PCB deformation
Method of preventing short circuit in SMT patch processing
Design methods to reduce stray capacitance of PCB: 1, remove the inner stratum, 2, use the Faraday shield, 3, increase the space between adjacent trace lines, 4, minimize the use of holes
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