Chinese called chip components) installed on the surface of the Printed Circuit Board (PCB) or other substrate surface, by reflow welding or dip welding and other methods to weld the circuit assembly technology.
At present, with the development of printed circuit boards to high density and high precision, more stringent requirements are put forward for sulfate copper plating process, and various factors in the copper plating process must be controlled at the same
high temperature performance is good: most of today's SMT circuit boards need to install components on both sides. Therefore, the PCB machined by SMT needs to be able to withstand two reflow soldering temperatures. At present, lead-free welding is widely
small aperture: most of the metallized holes in SMT are not used to insert component pins, and are no longer welded in the metallized holes
Control welding temperature: Reasonable control of welding temperature can avoid the formation of bubbles and voids below the solder joint. If the welding temperature is too high, the material below the solder joint will produce gas, resulting in virtual
Accumulated service for thousands of electronic enterprises, involving many types of automotive equipment and industrial control motherboard SMT processing services, products are often exported to Europe and the United States, quality can be affirmed by n
To mitigate this impact, manufacturers often take various measures, such as placing components in cooler areas or using components that are more resistant to high temperatures
Manual cleaning method is one of the simplest and most primitive methods to remove excess tin residue. It is mainly manually operated, using hand tools (such as scissors, scrapers, spray guns, etc.) to clean up excess tin residue. The advantage of this me
Solvent cleaning is a commonly used method to remove excess tin residue. It is mainly through chemical reaction, the use of solvents to dissolve or separate the excess tin residue. In general, commonly used solvents include acids, bases, organic solvents
Improper temperature control: If the temperature is insufficient, the solder will not be completely melted, and the solder joint may not be rounded. On the other hand, if the temperature is too high, the solder joint may be deformed.
Improve production efficiency: Traditional THD technology requires electronic components to be inserted into PCB holes one by one, and connected by manual or automated means, which is time-consuming and laborious. The SMT technology can achieve efficient
Welding process parameters: The selection and adjustment of welding process parameters will also affect the quality of welded joints. For example, the adjustment of parameters such as welding temperature, welding speed, crest height and period can achieve
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