2, the spring tension is insufficient, the suction nozzle and HOLD are not coordinated, resulting in poor feeding;Solution: Maintain the equipment regularly according to plan, check and replace the wearing parts. 3. Deformation of HOLD/SHAFT or PISTON, be
patch inspection: when or after the patch is completed, the quality inspection is carried out for whether there is any missing paste, dislocation, mispaste, component damage, etc.
In THT wave soldering, the preheating temperature should not only consider the activation temperature required by the flux, but also consider the preheating temperature required by SMC/SMD itself. Generally, the selection principle of preheating temperatu
Solder paste net and red glue net in the material is also very different. Solder paste mesh is usually made of stainless steel. This is because stainless steel has very good strength and corrosion resistance. In addition, the surface of stainless steel is
In addition to the above advantages and disadvantages, solder paste and red glue are also different in terms of use and process flow. When using solder paste for SMT processing, it is usually necessary to use a printing press to evenly print the solder pa
The selection and control of process parameters is one of the important factors affecting the quality of SMT processing. If the slight difference in temperature or time is not well controlled, it is easy to lead to poor tin penetration and other phenomena
FeedFeeding refers to feeding the components prepared in the preceding sequence in accordance with fixed procedures. At this stage, components need to be classified according to specifications, sizes, models, etc., and placed in the process location. Afte
Using outdated equipment and technology can result in too much or too little solder paste being applied to the pad, affecting the quality of the weld. Modern SMT plants usually use sophisticated equipment to apply the paste, such as printing presses and n
Patch short circuit refers to the electrical connection between two patches in the process of SMT patch processing. This problem may cause the circuit to work improperly and even cause equipment damage. The main reason for the short circuit of the patch i
SMT (Surface Mount Technology, surface mount Technology) is a technology that uses metal wires on the substrate to connect the electronic component directly to the substrate, rather than the traditional PTH (Through Hole Technology
Before SMT processing, the device and the board need to be processed. For components, it is necessary to carry out pre-preparation, including cleaning, stripping, processing, etc., to ensure that its quality meets the requirements. For PCB board
At present, some manufacturers use non-contact machine vision inspection method for PCB board inspection, this technology because of the high speed and high precision of non-contact measurement and detection, has been trusted by these manufacturers, it ca
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