When SMT components are placed, connectors are placed first, followed by power circuits, sensitive and precision circuits, critical circuit components, and any other required components. You are selecting route priorities based on power level, noise sensi
When SMT components are placed, connectors are placed first, followed by power circuits, sensitive and precision circuits, critical circuit components, and any other required components. You are selecting route priorities based on power level, noise sensi
A similar approach is used for SMT patch components with multiple pins and wide spacing. First, the pad is tinned, then one foot is welded with a tweezer holding the piece in the left hand, then the other foot is welded with a tin wire. It is usually best
coating thickness: if you want to get a thicker coating, by coating two layers of thin coating to obtain, and must be in the first layer of completely cured before allowed to coat the second layer; the thickness of the film layer: the addition of diluent
SMT chip technology processThe SMT patch process is divided into: solder paste printing, SMT patch, intermediate inspection, reflow soldering, post-stove inspection, performance test, and repair.SMT patch process flow chart1. Solder paste printing machine
The workshop supervisor of SMT patch processing and production shall reasonably arrange the workshop plan according to the weekly and monthly plan of PMC department and the material supply situation, and arrange the elongation of each line body and techni
High-end equipment can stick precision shaped parts, BGA, QFN, 0201 materials. Can also template patch, loose material hand
There are many reasons for the tilt of the pad. Because the position of the pad is below the component, the blind spot of the repair technician may try to move the component, resulting in the tilt of the pad, because he cannot see the solder joint during
Strong maintenance ability and perfect after-sales service Experienced maintenance engineers can repair all kinds of patch welding caused by bad products, to ensure the connection rate of each piece of circuit board.
SMT machine, so engineers need to manually patch and then reflow weld.1. Clean and secure the PCBWhen the PCB board is processed by patch, the PCB should be checked briefly first to ensure that its surface is clean and whether there are impurities. If the
If before use, the solder paste is not fully stirred, the flux and tin powder is not fully integrated, then it will also lead to some solder joints of the tin is not full.1
The first point: size error problem second point: component offset problem third point: temperature control problem Fourth point: PCB board surface treatment problem
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