The external processing of three anti-paint is bound to cause the continuous transfer of PCBA, which is easy to cause collision, ESD electrostatic breakdown and other potential defects. PCBA factories need to be equipped with three anti-paint spraying pro
SMT placement machine selection. SMT SMT machine selection is the foundation of SMT plant, should be based on the production of product type and output to choose. Generally speaking, the selection of the patch machine is based on the patch speed, accuracy
Electroerosion formwork currently accounts for about 2~3% of the use. Its manufacturing process is additive. Unlike other processes, the formwork forming method is as follows.
When adjusting the width of the guide rail, pull out all PCB supporting thimbles. There should be no PCB at the entrance and exit ends to prevent damage to the guide rail. After adjusting the width of guide rail, adjust the width of guide rail of buffer t
PCB plan. Such as some large power board (such as power supply class), due to the PCB generally has more large volume components, such components due to more simple heat absorption makes the whole piece of PCB heating uneven, even sometimes dewetting appe
When selecting the thickness of steel sheet, under the condition that the quality of solder joint is guaranteed, the lower thickness shall be selected according to the standard of IPC-7525A and the actual PCB components, and the larger one shall be avoide
Take the chip element with square pad design as an example, as shown in Figure 2 below. After the solder paste printing, if there is more solder paste, it is easy to produce tin beads.
the poor lubrication of the feeder is generally maintenance and maintenance of the feeder, which is easy to be ignored, but regular cleaning, cleaning, refueling lubrication is an essential work.
Once the embedded designer has determined the wire width and spacing, the number of wires to be routed through a channel, and the type of holes to be routed for the BGA layout design, he or she can estimate the number of PCB layers required.
The use of such a high heat source to try to achieve a relatively low temperature on the PCB surface greatly increases the possibility of flux overburning.
PCB pressing process control. After PCB has been pressed and baked, the Tg values of the samples can be measured twice by the same method and the same machine.
Formation mechanism: During reflow welding, the heating of chip components is heated at the same time. Generally speaking, the pad with the largest exposed area is first heated to a temperature above the melting point of the paste. In this way, one end of
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