What are the precautions of SMT patch process?
Single-side assembly process: incoming material detection - screen welding paste - patch - drying - reflow welding - cleaning - detection - maintenance
Single-side assembly process: incoming material detection - screen welding paste - patch - drying - reflow welding - cleaning - detection - maintenance
Check PCB incoming materials. Whether the welding plate is oxidized, the printed board is deformed, the printed board is scratched; Inspection method: Visual inspection according to the inspection specification.
Package of integrated circuits in which the input and output points are tin balls arranged in a grid pattern on the underside of the component.
The SMT factory shall establish a complete management system for better management, such as ERP management system, quality management system, safety management system, equipment management system and personnel management system
SMT technology application: 1, chip patch: 2, film patch: 3, IC patch
SMT plant application: 1, electronic assembly: 2, electronic parts welding: 3, printed circuit board
SMT proofing technical requirements include three aspects: 1, installation and positioning technology: 2, welding technology: 3, patch technology: 4, pad precision technology: 5, optical detection technology, 6, quality control technology
SMT features: 1. Small size, light weight, small area, high durability, flexibility, etc. 2. It has high reliability. 3.SMT is finished by automatic SMT machine, and high-speed SMT can be realized
SMT processing advantages: SMT processing technology has good reliability, its technology has good precision, fusion welding contact area is large, fusion welding structure is firm, stable, good heat conduction performance, eliminate high temperature weld
SMT patch process: 1, cleaning, 2, pre-welding: 3, patch: 4, welding: 5, detection: 6, assembly
SMT proofing requirements: a. Technical requirements, b. Patience requirements: c. Quality requirements: d. Precision requirement
The specific process of SMT OEM is mainly divided into eight steps: application requirement analysis, design confirmation, material preparation, production preparation, PCB cleaning, SMT mounting, SMT welding, testing and testing