SMD materials must be exquisite, not ready for SMT patch proofing. There are still some problems with SMD materials, from the quantity of incoming materials to the specific specifications and parameters of the materials, we must pay attention to, so that
SMT can greatly reduce production time. Moreover, SMT components can be placed in the thousands per hour, compared to less than a thousand for through-hole installations.
Failure analysis is an important part in the reliability of SMT electronic assembly process. It is necessary to have certain testing and analysis equipment to carry out the failure analysis of electronic process.
In PCB production, the circuit board also needs to be tested to see whether the circuit is open, short circuit phenomenon. This works as a needle bed, testing against each network point
The PCBA project should be completed in seven steps: first, preliminary preparation stage, second, design and development, third, design and editing of operation instruction of SMT production process, fourth, confirmation of steel mesh production ability,
The reasons for virtual welding in SMT patch processing are: (1) Virtual welding caused by SMT process factors; (2) Virtual welding caused by PCB factors; (3) Virtual welding caused by component factors; (4) Virtual welding caused by SMT equipment factors
There may be seven reasons for unrounded solder joints in SMT processing: 1. Slag and bubbles: 2. Improper temperature control: 3. Insufficient welding time; 4. Insufficient soldering tin; 5. Uneven PCB surface: 6. The solder particle is too large: 7. The
The following are four ways to ensure the quality of PCBA processing: 1. Quality control, 2. Inspection and testing, 3. Use high quality raw materials: 4. Professional technical team
Reflow welding may have some effects on SMT machining quality: 1. PCB deformation caused by temperature gradient; 2. Component damage caused by temperature gradient, 3. Oxidation in reflow welding process
There are five technological means to improve the pass-through rate: (1) optimize the design of steel mesh, (2) select the appropriate solder paste, (3) optimize the printing operation, (4) optimize the temperature curve, (5) adopt tooling and improve the
In order to do a good job in PCBA processing, we need to do the following three things: first, solder paste should be used during SMT processing; second, the SMT equipment must be checked frequently during SMT processing; third, we should always pay atten
Factors affecting SMT processing quality: 1, equipment, 2, technology, 3, PCB circuit board, 4, steel mesh (template), 5, furnace temperature curve setting
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