SMT patch processing refers to the process of pasting electronic components and other materials on PCB bare board. It is a popular processing technology in electronic assembly industry.
PCBA proofing processing common production procedures :1. Repair: 2. Mounting: 3. Testing: 4. Curing: 5. Cleaning: 6. Solder paste printing: 7. Reflow welding: 8. dispensing
Why should we do electrostatic protection in PCBA processing? PCBA board has precision electronic components, many components are more sensitive to voltage. A shock above the rated voltage will damage these components
SMT proofing small batch processing said of high charges mainly refers to the loss of time, rather than start-up loss. That is to say, before SMT processing, whether it is large area SMT processing or small scale SMT processing, the preliminary work needs
SMT patch processing common detection methods: 1, optical detection method, 2, artificial visual detection method, 3, AOI detection method
SMT patch processing common materials: 1, patch resistance, 2, patch capacitor, 3, induction coil, 4, transformer, 5, crystal diode, 6, field effect transistor
Before the production of products, the production materials must be inspected according to the inspection standards and inspection process documents to ensure the production and quality of products, at the same time, to ensure the normal supply of materia
SMT processing plant plays an important role in the electronic processing industry, which is indispensable for the precision and miniaturization of electronic products
In terms of the overall process capability of SMT today, the solder paste printing ability is the worst. Because the solder paste printing more or less or the printing offset are related to the quality of the solder behind, it is the most need to be speci
SMT manufacturing units are fully automatic, high precision and high speed. As the degree of automation increases, PCB design must meet the SMT equipment requirements.
Solutions to printing faults in SMT patch processing: 1. There is no gap between the mold and PCB printing mode, which is called "touch printing". Second, the installation should choose the IC installation height of no more than 0.5mm, 0mm or 0~...
There are five methods to solve the welding porosity of the patch: 1, baking, 2, tin paste, 3, humidity, 4, furnace temperature curve, 5, flux
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