Common causes and solutions of material loss in SMT patch processing
Common causes of material loss in SMT patch processing: 1, human factors, 2, machine factors, 3, material reasons, 4, working methods, 5, production environment
Common causes of material loss in SMT patch processing: 1, human factors, 2, machine factors, 3, material reasons, 4, working methods, 5, production environment
What is PCB, SMT, PCBA: 1, PCB is used to support electronic components, and provide lines, so that electronic components can form a complete circuit, 2, SMT is a popular technology, also known as surface mounting technology, 3, PCBA refers to the purchas
Classification of PCBA inspection items: inspection items are divided into four categories: material inspection, process inspection, identification inspection and quality consistency inspection
Types of SMT SMT process materials: (1) solder and solder paste, (2) flux, (3) binder, (4) cleaning agent
SMT patch proofing processing and installation IC notes: 1, the welding time is short, not more than 3s, 2, the use of electric iron constant temperature 230 degrees, 3, proofing table do anti-static treatment. 4, choose some pointed and narrow iron head,
SMT surface mount technology has the following 5 steps: 1. PCB production - this is the actual production stage of PCB with solder points; 2. Deposit solder on the pad to fix the assembly to the plate; 3. With the help of the machine, the components are p
Solder paste, solder paste, and solder paste are two kinds of products - solder paste and solder paste, solder paste and solder paste can be distinguished from the appearance of color, solder paste is yellow, solder paste will hair gray or black, this is
What aspects of PCB have an impact on PCBA: one, PCB board surface dirty, two, white slag, three, PCB deformation
Design methods to reduce stray capacitance of PCB: 1, remove the inner stratum, 2, use the Faraday shield, 3, increase the space between adjacent trace lines, 4, minimize the use of holes
Literally, it is a technique for welding electronic parts to the surface of a PCB, unlike earlier through-hole parts, using "wave welding", which drastically reduces the size of electronic products to make them lighter, thinner, shorter and smal...
To improve the pass rate of SMT patch processing, the following five process optimization methods are required :1. Improved pcb circuit board steel mesh design;2. Select the appropriate solder paste type; 3. Improve the printing process operation method;
SMT patch processing for the requirements of flux: 1. The appearance of the flux should be uniform, transparent, no foreign matter. 2 viscosity and density than molten solder is small, 4 melting point than solder is low, 5 welding does not produce welding