SMT SMT processing discarding solutions: 1. Clean and replace the nozzle, 2. Clean and wipe the surface of the identification system, keep it clean, free of debris, 3. Adjust the suction position, 4. Sharply adjust the air pressure to the required pressur
Solder paste printing principle: solder paste contact solder paste through the steel plate hole, printed on the substrate tin pad (PCB plate solder plate).
Follow reasonable testing methods to avoid various defects and hidden dangers: I. Incoming SMT material testing; II. SMT processing testing
The reason for the high price of SMT proofing in small batches: The proofing cost of small batches of SMT mainly includes start-up fee, engineering fee, steel mesh fee, processing fee calculated according to conventional points, or summarized directly wit
The smaller size of SMT compared to traditional through-hole inserts makes manual repair at mount or component level more difficult, requiring skilled workers and more expensive repair tools.
SMT is an electronic circuit production technology where components are mounted or placed directly on the surface of a printed circuit board. In this industry, there are two methods: SMD and THT.
According to the requirements and requirements of failure analysis, it is necessary to adopt various analysis techniques and methods to determine the location of failure, the degree of failure, the cause and mechanism of failure.
SMT patch processing main characteristics: 1, high density: 2, small aperture: 3, low coefficient of thermal expansion: 4, high temperature resistance performance:
Manual welding methods for SMT patch processing of leadless chip components: one by one welding spot, two, using special tools horseshoe iron head welding, three, using flat chip iron head quick welding
SMT SMT technology: The main content of surface assembly technology can be divided into four parts: assembly material selection, assembly process design, assembly technology and assembly equipment application.
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, testing, repair
Aluminum substrate and glass fiber plate difference and applicationFirst, glass fiber board (FR4, single-sided, double-sided, multi-layer PCB circuit board, impedance board, blind buried hole board), suitable for computer, mobile phone and other electroni
Telegram