The main adverse phenomena in the solder paste printing process of SMT patch processing are as follows:After printing, the solder paste is not enough and gradually spreads to the outside of the pad. Reason analysis: 1, the scraper pressure is too large, 2
Analysis of the causes of short-circuit defects: 1, the solder paste collapse 2, the bottom surface of the steel mesh contaminated, 3, the pressure is too large to lead to the solder paste from the bottom of the steel mesh seepage surface overflow pad to
To introduce the most detailed process of SMT patch:1, PCB board, 2, three anti-paint coating
Reflow welding has become the mainstream process of surface mounting, it depends on the influence of hot gas flow on the solder joint, colloidal flux in a certain high temperature air flow for physical reaction, achieve SMD welding, the quality of PCBA so
SMT patch processing PCBA overhaul includes what aspects: ① Check the electronic devices, each spot welding electronic devices are not wrong version, leakage, reverse problem exists, ② spot welding welding is not smooth, there is no abnormality, ③ query d
necessary to set up professional testing equipment in each process and strictly control the quality of the process
SMT patch processing what solder paste:First, there are lead and lead-free solder paste, two, high temperature solder paste, medium temperature solder paste, low temperature solder paste, three, tin powder particle size
SMT machining components are repaired: 1. Chip components welding disassembly, 2. Pad cleaning, 3. Assembly and welding of chip components
If you want to find high quality manufacturers, you must follow the following points: first, focus on whether it is appropriate, two, look at the equipment, three, choose not to choose to see professional cooperation, four, quality management,
Circuit board testing and printing pcb circuit boards are initially applied in paper-based copper-covered circuit boards. Since the appearance of semiconductor material audion in the 50's of the 20th century, the demand for circuit boards has increased si
How to design PCB for SMT patch processing: 1. First determine the function of electronic products, performance indicators, cost and overall size of the overall goal, 2. Electrical principle and mechanical structure design, according to the structure of t
Prevention cost refers to the cost paid to prevent the occurrence of quality defects; Appraisal cost refers to the cost paid for testing, inspection and inspection in order to assess whether the product has the specified quality; Internal defect cost refe
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