Application scope: SMT, LED, BGA, CSP flip chip testing, semiconductor, packaging components, lithium industry, electronic components, automotive parts, photovoltaic industry, aluminum die casting, molded plastics, ceramic products and other special indus
In the SMT process of the PCB manufacturer, the solder paste printing, the operation of the SMT machine, and the welding of the reflow welding furnace should be listed as the key processes.
The rapid development and popularization of SMT processing has played a unique role in promoting the development of modern information industry.
Patch processing manufacturers will determine whether to make solder paste steel net or red rubber steel net based on the component design of PCB board. Generally, if there are many plug-ins, wave soldering is required, red rubber net process will be used
The main reasons for poor wetting are: 1, the surface of the welding area is polluted, 2, when the residual metal in the solder exceeds 0.005%, the activity of the flux is reduced, 3, wave soldering, there is gas on the surface of the substrate,
Analysis of bad causes of PCBA patch processing plant: 1, PCBA air welding, 2, PCBA short circuit, 3, PCBA warping, 4, PCBA missing parts, 5, PCBA tin beads, 6, PCBA offset
The emptiness is mainly caused by the following reasons: first, welding paste. Two, PCB welding pad surface treatment. Three, reflux curve setting. Four, reflux environment. Five, pad planning. Six, micropores.
What are SMT patch, PCB circuit board, PCBA processing and DIP plug-in respectively? First, SMT is one of the basic components of electronic components, which is called surface assembly technology; second, PCB is the most important component of electronic
To repair and maintain the internal circuit board, the following maintenance methods are: 1, inspection components, 2, welding state analysis, 3, component direction detection, 4, tool inspection of parts, 5, startup test
Key parameters of reflow welding equipment :1. Number, length and width of temperature zone; 2. Symmetry of upper and lower heaters; 3. Uniformity of temperature distribution in the warm zone; 4. Independence of transmission speed control in temperature i
The reasons for component displacement in patch processing are as follows: 1, the use time of solder paste is limited, 2, the solder paste itself is not sticky enough, 3, the flux content in solder paste is too high, 4, in the process of printing and patc
Factors affecting the printing thickness of solder paste: reduce the thickness of steel mesh plate, is to reduce the amount of solder paste, solder paste melting surface tension will be reduced. When the thickness is reduced, the solder paste is thinner,
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