Chemically etched SMT patch processing template
On pre-tinned PCB, the porosity of BGA joint increases with the increase of solvent volatility, metal composition and melting temperature, and also with the decrease of powder size.
On pre-tinned PCB, the porosity of BGA joint increases with the increase of solvent volatility, metal composition and melting temperature, and also with the decrease of powder size.
SMT patch introductionSMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board.SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for
SMT basic processSMT patch refers to the abbreviation of a series of process processes processed on the basis of PCB. PCB (Printed Circuit Board) is a printed circuit board.SMT is Surface Mount Technology (Surface Mount Technology) (abbreviation for Surfa
The disassembly method of SMT patch components depends on the characteristics of the components themselves. For components with fewer pins such as resistors, capacitors, diodes or triodes, one of the pads is first welded to the PCB circuit board
The first piece detects operation on the SMT patchThe first piece detection is an essential mechanism in the production and processing process of PCBA contracted work and materials. In the production process of PCBA, the first piece detection can help peo
The most detailed procedures in SMT SMT: PCB assembling board ,three anti-paint coating improper fixture design.
Brief introduction to the main points of SMT assembly process of BGA componentsFPC factory When SMT (Surface Mount Technology)/SMD (Surface Mount Device) practitioners find that QFP (Quad Flat Package) with a pitch of 0.3mm cannot be realized, the emergen
The calculation of SMT chip processing points is the main basis for the calculation of processing costs. Many customers who have only come into contact with the SMT processing industry do not know how to calculate the price.
Welding pin cleaning solder cleaning welding point strength guarantee 2 quality guarantee, cost-effective electronic products patch, welding experience, strong repair ability, perfect after-sales service
Process flow of SMT patchIn order to allow us to develop better and learn more about product device information, the company specially arranged for us to go to the raw material supplier to learn the process flow of SMT placement. The sharing information i
The DIP plug-in process is a part of the PCBA process after the SMT patch process. The DIP plug-in process can be roughly divided into plug-in, wave soldering, foot cutting, inspection, testing and other processes.
SMT outsourcing process 1. Production materials provided by customers; 2. Process evaluation; 3. PCB production and component procurement 4. Sample production; 5. Sample confirmation; 6. Mass production; 7. Circuit board test; 8. Packaging and delivery.