For high - level circuit board processing technology research literature, the industry is relatively few. This paper introduces the control points of key production processes, such as material selection, laminated structure design, interlayer alignment, i
According to the laminated structure of the high-rise board and the materials used, study the appropriate pressing procedure, set the best temperature rise rate and curve, in the conventional multi-layer circuit board pressing procedure, properly reduce t
In the high-speed design, we must consider the capacitance of the parasitic parameters, quantitative calculation of the number of decoupling capacitors and the capacity of each capacitor and the specific position of the placement, to ensure that the imped
Nickel-gold plating is the ancestor of the PCB surface treatment process. It has been around since the appearance of PCBS and has slowly evolved into other methods. It is the PCB surface conductor is first coated with a layer of nickel and then coated wit
The impedance and loss of PCB are crucial to the transmission of high-speed signals. In order to analyze such a complex transmission channel, we can study its impact on signals through the impact response of transmission channel.
SMT processing materials on the PCBA welding quality of the impact of the following: 1, the impact of components, 2, PCB, 3, the impact of solder paste
How to select high quality reflow soldering in PCBA processing plant: 1. Look at the heating method of reflow welding; 2. Look at the actual temperature difference of reflow welding; 3
pcba aging test standards: 1, low temperature work, 2, high temperature work, 3, high temperature and high humidity work
The circuit working at high frequency should consider the interference between components. The general circuit should make parallel arrangement of components as far as possible to facilitate wiring;
With the development of large-scale integrated circuit and super-large scale integrated circuit, the multilayer printed board (PCB) will be used more and more. In modern electronic systems, with the increase of clock frequency and chip integration, the ra
the shielding effect of the electromagnetic field is not good enough for some laminated schemes in the design of 6-layer board, which has little effect on the reduction of the transient signal of the power busbar. Two examples are discussed below.
Now PCB design time is shorter and shorter, smaller and smaller board space, higher and higher device density, extremely demanding layout rules and large size components make designers
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