Manufacturing problem
This means that the board's thermal expansion and contraction can be maintained at a stable limit at higher frequencies and temperatures when the PCB goes through cold, hot and very hot reflow cycles compared to FR4.
This means that the board's thermal expansion and contraction can be maintained at a stable limit at higher frequencies and temperatures when the PCB goes through cold, hot and very hot reflow cycles compared to FR4.
Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.
the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.
Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short
In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.
Internal equivalent PCB circuit and application PCB circuit some of the lead out feet are not marked, encounter empty lead feet, should not be grounded without permission,
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation characteristics can cause short circuits due to unexpected electrical connectivity/arcing.
Defective sheeting requires special assembly procedures. If the end-of-life unit board (x-out) is not clearly marked, or it is not isolated from the sheeting, the known defective board may be assembled, wasting parts and time.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.
these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.