The special requirements for power transmission lines and the need to isolate noise coupling between analog and digital circuits add further complexity to the layout and wiring of mixed-signal PCBS.
What does DFM stand for? What does DFM do? 1, reduce costs, improve product competitiveness, 2, optimize the production process, improve production efficiency, 3, conducive to technology transfer, strengthen the company collaboration, 4, the foundation of
1. PCBA processing refers to PCB bare board after SMT patch, DIP plug-in welding, post-welding, cleaning, three anti-paint spraying, testing aging, etc.; After the whole processing process to form PCBA, referred to as PCBA processing2.SMT patch processing
Key points of solder paste printing technology: 1, the Angle of the printing press scraper and steel mesh: 2, scraper pressure: 3, scraper speed, 4, printing gap: 5, release speed
PCBA processing and welding process is mainly divided into three parts: one is SMT reflow welding, two is DIP wave welding, three is manual soldering iron welding
Analysis of the causes of holes (bubbles) in solder joints in PCBA patch processing: 1, the influence of flux activity, 2, related to the oxidation degree of PCB pad, 3, the influence of solvent boiling point, 4, related to the welding time, 5, the solder
The spacing and size of conductive rubber keys shall be consistent with the actual size of conductive rubber keys, and the PCB board connected with this shall be designed as a gold finger, and the corresponding gold-plated thickness shall be specified.
Poor weldability of circuit board holes will produce virtual welding defects, affect the parameters of components in the circuit, lead to the instability of multilayer components and inner wire conduction, and cause the functional failure of the entire ci
the production of controllable impedance boards is becoming more and more important.
In PCB board copy and design work, we often have to debug and test the circuit board, the debugging of six types of module circuit board is one of them, in order to let you better understand the debugging technology of six types of module circuit board, f
Correct PCB pad design, if there is a small amount of skew during patch processing, can be corrected during reflow welding due to the action of surface tension of the molten solder.
Through the above analysis of the parasitic characteristics of the holes, we can see that in high-speed PCB design, seemingly simple holes often bring great negative effects to the circuit design.
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