PCB hole design tips to share
In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.
In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.
to produce a conductive channel on the circuit board that allows the later process to complete the connection between the upper/lower or intermediate circuit layers
it will also lead to insufficient bonding force between copper foil and substrate after laminate, resulting in positioning (only for the large plate) or sporadic copper wire loss, but the stripping strength of copper foil near the stripping line will not
Using the principle of electroplating, through the current and voltage control of gold plating on the surface. Anti-oxidation: The use of chemical principles of an anti-oxidation chemical coated on the surface
Although the circuit protection device is much smaller than in the past, it is impossible to add the circuit protection device without sufficient space after the PCB design is completed.
As we all know, circuit protection is mainly to protect the components of electronic circuits from damage under the circumstances of overvoltage, overcurrent, surge, electromagnetic interference, and so on, and the selection of appropriate circuit protect
A tin or lead tin resist covering the top of the line extends to both sides, forming a "rim" that covers a small portion of the sensitive film underneath the "rim".
installed on the Printed Circuit Board (PCB) surface or other substrate surface, through reflow welding or immersion welding and other methods to be welded and assembled circuit installation technology.
When working, the value of Vg (that is, the voltage value of the input signal) is a fixed value, which is either high level (may fluctuate) or low level.
In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, it is necessary to take a variety of technical measures to prevent.
It is characterized by surface mounting of components and reflow welding technology. It has become a new generation of assembly technology for electronic products manufacturing.
On the one hand, by controlling the high level voltage applied in the grid *, there is a channel between the source and drain, and the electrons flow from the source to the drain through the channel, and the direction of the current is from the drain to t