Rich experience in copying board on the basis of guaranteed success rate, but also can finish the work of copying board faster. High efficiency and high success rate make subroutine electronics highly praised in the industry.
Even the well-written and actually implemented technical specifications for PCB laminates do not specify the test items that must be carried out to determine that PCB laminates are the cause of manufacturing process problems.
The PCB layout determines the performance of a switched power converter. You don't have to spend countless hours debugging EMI, noise, signal integrity, and other issues associated with poor layout.
In addition to the machining technology, back drilling design and stump control also have some effects on PCB loss.
In the early PCB design, it is not allowed to have holes in the BGA pad, for fear that tin leakage will lead to insufficient solder paste on the pad, which will lead to the phenomenon of virtual welding and de-welding in the welding process of the device.
After the circuit is completed, solder resistance ink is coated on the circuit as protection of the circuit. There are liquid photosensitive, heat curing and UV hardening.
In the high-speed era, the ideal wiring on any section of schematic diagram has become an unsatisfactory wiring on PCB, bringing a variety of unexpected high-speed problems. Therefore, PCB engineers also need to accumulate experience and theoretical knowl
The above conclusions are similar when the power source ground distance is less than 10mil. However, when the power source is located at 20mil or even 50mil, the situation changes slightly. As shown in Figure 3, when the ground distance of the power suppl
PCB proofing is the basis of the mass production of circuit board products. It is important to save cost, improve design and break through innovation, so PCB proofing is an indispensable part of PCB batch processing.
Traditional hard board material is hard, can not adapt to the development of electronic products miniaturization, high density, light weight.
Electric soldering iron is the main repair tool. The core process of patch processing how to repair components is: diswelding and disassembling of chip components, cleaning of pad and assembly and welding of components.
Arrange professional PCBA production engineers to be responsible for SMT production line operation. Business, purchasing and production departments can cooperate with the review of new orders, production arrangement and product testing.
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