Basic requirements for high frequency microwave plates
High frequency microwave plate forming and printed board, CNC milling is the main. But the method of milling is very different for different materials.
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What are the characteristics of high frequency microwave printed board manufacturing?
In the high speed signal transmission line of printed board wire, one is the high frequency signal transmission class of electronic products, the other is the high speed logic signal transmission class of electronic products.
SMT patch processing how to calculate processing points
1, lead-free solder paste printing, lead-free solder paste printing, 2, small material mounting this process uses the machine is CP machine, 3, large material mounting this process uses XP machine,4, furnace QC, 5, reflow soldering reflow is to melt the s
Patch processing plant which good how to judge
FHow do you choose a flux?First, combined with product selection, second, according to customer requirements to choose, third, according to the equipment process selection
How to ensure safety in SMT patch processing
It is necessary to check regularly whether the power supply on the SMT patch processing line has done all kinds of safety protection, and also to do special training on power supply protection. In the SMT patch processing and production process, it is nec
The difference and application of PTH hole and NPTH hole
In PCB design, the hole has four functions: electrical conduction, positioning, heat dissipation, convenient board. It is also divided into pass-through holes and non-pass-through holes. Only PTH holes have pore rings, while NPTH holes have no pore rings.
The later inning of the PCB design cycle is a win
The learning curve can be made as flat as possible by design reuse of known good circuits. The noisy power supply and those emo receiving chains can no longer be separated. We did everything they asked and more.
How to reduce patch processing pollution
Weld the electrode to the pad on the same side as the component. The through hole on the printed board only plays the role of the circuit connecting wire, and the diameter of the hole is determined by the technological level of the metallized hole when th
The reason analysis and control improvement of soft - hard combination board
The expansion and shrinkage of flexible plate materials are mainly related to matrix material PI and glue. The higher the degree of iminization, the stronger the controllability of expansion and shrinkage.
How is the soft - hard combination board defined
The soft and hard combined board is made of two groups of hard cover plate on the upper and lower surfaces of the circuit board, among which one or more layers of FPC are sandwiched in the middle, and the cover plate area is maintained as no line.
How to control FPC cost and size stability
In recent years, with the rapid development of PCB manufacturing process, the industry has put forward higher requirements for FPC. Precision PITCH is the main breakthrough direction of FPC in the future.
How to choose hot melt adhesive for patch processing
How to choose hot melt adhesive and hot melt adhesive use points for attention: first, the color of the adhesive, second, followed by surface treatment, three, working time, four, temperature resistance, five, viscosity
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