Practice has proved that even if the circuit schematic design is correct and the printed circuit board is improperly designed, the reliability of electronic equipment will be adversely affected.
to see what is the surface treatment process, we commonly have: spray lead tin (hot air leveling), OSP(environmental protection board), spray pure tin, tin, silver, gold and so on, of course, the surface process is different, the price will be different.
Take the chip element with square pad design as an example, as shown in Figure 2 below. After the solder paste printing, if there is more solder paste, it is easy to produce tin beads.
PCB circuit board and FPC flexible circuit board hot pressing machine heating methods now mainly have steam, superhot water, hot oil three methods.
the poor lubrication of the feeder is generally maintenance and maintenance of the feeder, which is easy to be ignored, but regular cleaning, cleaning, refueling lubrication is an essential work.
pcb circuit board has a variety of production processes, such as gold-plated plate and tin plate, the production of shape gong (milling) board and beer (punching) board, the use of silk screen line and dry film line, different production process costs are
In PCB circuit design, the coupling between differential routing is generally small, often accounting for only 10~20% of the coupling degree, more or the coupling to the ground, so the main return path of differential routing still exists in the ground pl
PCB (English Printed Circuie Board printed circuit board is short for) with nickel plating as the substrate coating of precious metals and base metals, for some single-sided printed boards, also commonly used as the surface layer.
When a certain amount of reaction product copper powder is generated, the reaction is catalyzed and sensitive, which will soon make the chemical copper completely ineffective. In order to control the rehabilitation response of the solution itself, pcb man
The RF part is grounded by multi-point grounding. The copper gap of RF link is usually 30mil to 40mil. Connect ground holes on both sides with the same spacing as possible. Make a grounding hole as close as possible to the grounding pad of the ground capa
The use of such a high heat source to try to achieve a relatively low temperature on the PCB surface greatly increases the possibility of flux overburning.
Because the soft and hard combined board is the combination of FPC and PCB, the production of soft and hard combined board should be equipped with both FPC production equipment and PCB production equipment.
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