The same material produced by different pcb manufacturers varies due to its resin content. The dielectric constant decreases with the increase of frequency, so in practical application, the dielectric constant of materials should be determined according t
High Tg material: the so-called Tg value, now electronic products require the circuit board to be resistant to high temperature, at a certain temperature, the circuit board can not burn, can be softened, the softening temperature is called glass conversio
Flux spraying The PCB is carried by the X/Y manipulator through the flux nozzle, and the flux is sprayed on the PCB to be welded. Flux has a single nozzle spray, microporous spray, synchronous multi - point/graphic spray.
Poor brittleness and weldability of the coating: When the coating is bent or subjected to some degree of wear, the brittleness of the coating is usually revealed.
only light gas precipitation. Generally, the PH value of PCB nickel plating electrolyte is maintained between 3 and 4. The nickel plating solution with higher PH value has higher dispersion force and higher cathode current efficiency.
Introduction of nickel electroplating process for printed circuit board PCBPCB (English PrintedCircuieBoard printed circuit board is short for) with nickel plating as the substrate coating of precious metals and base metals, for some single-sided printed
For some basic electronic circuit framework and schematic method, engineers need to master, not only to be able to draw some simple and classic basic cell circuit composition form directly, but also to form the overall framework of electronic circuit.
Wiring rules for high speed PCB boards with four or more layers.PCB version is divided into many layers, which high four layers of wiring skills, the following for you to introduce, I hope to help you.
At present, electronic and digital products, automobiles, medical products and other products such as circuit board production requirements for the process and speed is relatively strict
The ground point of the circuit of the same level should be as close as possible, and the power filter capacitor of the circuit should also be connected to the ground point of the level.
The severe shrinkage of PCB parts after the transfer of the outer pattern caused by the poor dimensional stability of PCB substrates in individual batches can only be detected by the measurement of the outer pattern production first plate or during the sh
Digital circuit and analog circuit isolation. It is a general principle in all PCB designs to keep digital circuits as far away from analog circuits as possible, and it applies to RF PCB designs as well.
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