High Density Interconnect (HDI) is a technique for creating high speed and high density PCBS. HDI uses blind and buried holes to increase signal density and thus improve the performance of printed circuit boards.
Formal product lifecycle management can achieve significant improvements throughout the development phase of a project. Benefits are limited to project management and all stakeholders, including the product design team.
The PLM process should support the collation and management of product information into a single authentic source from which product documentation, such as user manuals or marketing materials, can be generated.
In a more complex electronic circuit design, you can use the circuit equation design method, this method is a digital model for analog design, greatly simplified the design process.
One of the key considerations in designing rigid-flexible PCB is the width and spacing of the wires. This is important because the wiring needs to withstand the mechanical stress of bending during assembly.
The following is a calculation example of the position accuracy of the intermediate component of PCB board in the following two positions (the position accuracy calculation of the length direction is only taken as an example, and the width direction is no
In the process of high-speed circuit design, we must consider how to deal with the radiation of the power supply and the interference to the whole system. Generally, the area of the power layer plane should be smaller than the area of the ground plane, so
PCB design based on PCB design software can also be regarded as a software development process. Software engineering pays most attention to the idea of "iterative development" to reduce the probability of PCB errors.
sinking gold plate and gold plate is the same process product, electric gold plate and flash gold plate is the same process product, in fact, it is just different people in the PCB industry of different names, sinking gold plate and electric gold plate is
The depth of the holes usually does not exceed a certain ratio (aperture). Buried holes are connection holes located in the inner layer of the PCB that do not extend to the surface of the PCB.
In addition, in winter, when the tank liquid in some factories is not heated, special attention should be paid to the live into the tank of the production process, especially the plating tank with air stirring, such as copper nickel
The correct detection, measurement and analysis of "burst" mode wireless signal is a very meaningful work for SI design.
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