Maintenance knowledge
The basic knowledge of each device on the circuit board is repaired and tested until the bad parts are found and replaced, so a circuit board is repaired.
The basic knowledge of each device on the circuit board is repaired and tested until the bad parts are found and replaced, so a circuit board is repaired.
With the introduction of surface mount technology, automatic detection technology of circuit board is applied, and the packaging density of circuit board increases rapidly.
The circuit board makes the circuit miniaturized and intuitive, which plays an important role in the mass production of fixed circuit and the optimization of electrical appliance layout.
depending on the thickness of the gold layer, if the thickness is thin, the nickel layer may appear in the gold layer due to diffusion and oxidation, affecting the reliability, not inadvertently.
This process can ensure that the oil cover through the hole is good, the plug hole is smooth, the wet film color is consistent, the hot air leveling can ensure that the through hole is not tin, no tin beads in the hole, but it is easy to cause the ink pad
When we combine the forward - clock - oriented field and the reverse - clock - oriented field, the effect of elimination can be produced.
The above examples can help us understand Maxwell equations and PCB routing, and they are illustrated by very simple mathematical formulas.
This technology has become a necessary means of detection in fine wire production, and is being rapidly popularized, applied and developed.
the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.
The best stacking mode, because the use of multi-layer ground reference plane has very good geomagnetic absorption capacity.
In the design of the power resistance as far as possible to select some large components, and adjust the layout of the printed circuit board so that it has enough space for heat dissipation.
The solder on the surface of the solder joint forms a sharp tip. This is mostly due to insufficient heating temperature or too little flux, as well as improper Angle when the iron leaves the solder joint.