Precautions for the use of moisture sensitive devices in PCBA processing:1. Ovens used for baking are required to be ventilated and able to operate under the condition of humidity less than 5%. 2. SMT components shipped in high-temperature carriers can be
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, testing, repair
Factors affecting the quality of BGA patch assembly: 1. Feasibility of BGA pad design, 2. The through hole is distributed externally to the BGA pad. 3. The through hole of the pad has developed with the development of microporous technology in PCB manufac
No cleaning means that the residues of PCB circuit boards are safe from the chemical point of view, will not have any impact on the production line of PCB circuit boards, and can be left on PCB circuit boards
In PCBA processing, there are several process points in the whole process of rework and reflow: 1. Repair reflow welding curve should be close to the original welding curve. 2. In the reflux process, the heating temperature and time of each area should be
The following factors should be considered in the processing of PCBA capacitor components: first, the selection of capacitor voltage resistance, second, capacitance selection, third, capacitor medium selection,
◆ Main factors affecting the viscosity of solder paste: 1. Shape and temperature, 2. Thixotropic coefficient of solder paste, 3. Wettability of solder paste
Different welding resistance film due to the composition, content is different, and coating bonding force is not consistent, so the adhesion degree of coating and printed board welding resistance film and coating molecular polarity is closely related to t
When adding solder paste to patch processing, there are four main requirements: 1, must be uniform, 2, the amount of solder paste is different, 3, deviation, 4, to ensure that there is no collapse, the edge is neat
One of the major trends of PCB design is gradually inclined to open source hardware mode and control system, another is the explosive growth of development board, PCB design tools are now being used in more and more development board design.
In the aspect of PCB analysis, it is mainly used to measure the thermal stability or thermal decomposition temperature of PCB materials. If the thermal decomposition temperature of the substrate is too low, PCB will explode or delamination failure phenome
When designing PCB, how to avoid errors: first, data input stage, second, post-layout inspection stage, third, post-wiring inspection stage
