PCB mixed signal circuit board design criteria
Avoid running digital clock lines and high frequency analog signal lines near the power layer; otherwise, the noise from the power signal will be coupled to the sensitive analog signal.
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There are seven aspects of PCB wiring that need to be paid attention to
The PCB of digital circuit can be composed of a wide ground wire circuit, that is, to form a ground network to use (the ground of analog circuit can not be used in this way) with a large area of copper layer as ground, in the printed board is not used to
Specification for size of patch element sealing pad in PCB
There is no through hole between the welding pads of components without external pins (such as chip resistance, capacitor, adjustable potentiometer, adjustable capacitor,
Special-shaped pad
Need to have a detailed understanding of PCB substrate quality (such as size and temperature stability), materials, mimeographing process capacity and relative suppliers, need to sort out and establish their own substrate specifications.
PCB board impedance board definition
General simulation software cannot take into account some impedance discontinuity wiring conditions due to the line model or the mathematical algorithm used. In this case, only some Temninators, such as series resistors, can be reserved on the schematic d
Introduction to common PCB microporous technology
All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit. Poor insulation due to thin solder resistance layer can cause short circuit due to unexpected conduction/arc.
PCB board of 22 rules to share experience
That is: the actual out of the board is the circuit diagram to the right edge line as the reference line to the right after 180 degrees of the page. Pay special attention when there is a blank space! Otherwise the board is useless!
Cause and improvement of PCB deformation
That is to say, ordinary PCB substrate materials at high temperature, not only produce softening, deformation, melting and other phenomena, but also show a sharp decline in mechanical and electrical characteristics.
Discussion on the cause and countermeasure of the hole wall coating cavity of circuit board
There are many factors causing the coating cavity, the most common is PTH coating cavity, by controlling the relevant process parameters of the potion can effectively reduce the generation of PTH coating cavity. But other factors can not be ignored, only
Hole wall erosion/removal of hole wall resin drilling dirt
the effect is not ideal, and the use of plasma to drill dirt and dent, can obtain better roughness of the hole wall, conducive to the hole metallization electroplating, and at the same time has the "three-dimensional" dent connection characteris...
The structure of the welding pad on the circuit board
A blind by-pass hole and a microvia hole are created in the pad to allow direct wiring to another layer. Because these bypass holes are small and blind, they do not suck up much solder, resulting in little or no effect on the amount of tin in the solder j
There are three main factors that contribute to the velocity and depth of the flow of resist
The ejected pumice powder particles may enter the pore at a high rate and wash away the catalytic layer particles. On the other hand, the graphite process seems to tolerate pumice stucco treatment.
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