Catalytic steps prior to chemical deposition of copper
he natural bubble is caused by the reaction of hydrogen in the chemical copper solution, or the cathode to produce hydrogen or anode to produce oxygen in the electroplating solution.
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How to place and install decoupling capacitors in PCB layout
The size of the digital circuit output current Ioh pulled from the power supply at high voltages and the current Iol injected at low voltages is generally different, that is, Iol > Ioh.
The process of plugging through holes is applied and born
Electronic products are very afraid of damage, if you need to use electronic products in harsh environments. It is strongly recommended to coat the PCB board with three anti - adhesive, which will form a protective coating.
pcb coupling
Increase the dielectric constant of PCB board, which can prevent the high frequency parts such as the transmission line near the board from radiating outward.
Uv laser processing applications in PCB industry
Each circuit layer in the multilayer circuit board is pressed together by the action of semi-cured sheet; Depending on the circuit design, some areas of the semi-cured sheet need to be cut and then pressed together.
Review according to the "PCB checklist
Therefore, careful consideration should be given to the placement of ground wires in the layout. Mixing all kinds of ground will cause unstable power supply. The following points should be noted in the design of ground wire:
About PCB high frequency circuit board wiring tips
The parameters of PCB board layer, the distance between signal wires, the electrical characteristics of the driver and receiver end, and the connection mode of signal wires all have a certain influence on the crosstalk.
The difference between PCB gold sinking process and gold plating process
Now the production of gold plate is rarely, in the actual trial process, 90% of the gold plate can be replaced by gold plate sinking gold plate, gold plate welding poor is his fatal shortage, is also the direct cause of Princecircuit to give up gold plate
Flexible circuit board FPC hot air leveling
it is easy to drill solder from the end of the covering layer to under the covering layer, especially when the bonding strength of the covering layer and copper foil surface is low, this phenomenon is more likely to occur frequently.
Line impedance
When a constant current is obtained from the power source, the transmission line looks like an impedance and has a constant impedance value, which can be called the "surge impedance" of the transmission line.
About the test coupon
In principle, the smaller the test point, the better (of course, to meet the requirements of the test machine), the shorter the branch, the better.
Consider the overall aesthetics
The success of a product, one is to pay attention to the internal quality, two is to take into account the overall beauty, both are more perfect in order to consider the product is a success.
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