PCB stacking PCB design principles. The most efficient way to stack boards is to arrange the main ground (the main ground) in the second layer below the surface, and to arrange RF lines on the surface as much as possible.
With these tools, problems can be detected before the ENIG board is used, avoiding the creation of a large number of board components with reliability problems and keeping losses to a minimum.
ENIG surface treatment circuit board is one of the biggest advantages of the circuit board production and manufacturing process is simple, in principle only need to use two kinds of chemical potion (electroless nickel plating and acid gold water) can be c
Now the installation is mechanized, the hole position of the circuit board and the deformation error of the circuit and the design should be within the allowable range.
Experienced power developers know that EMI suppression in the PCB design process can save a lot of time for EMI suppression design in the final process to the greatest extent. This article will explain to you the specification steps in PCB EMI design, int
Solder joint as a direct result of welding, its quality and reliability determine the quality of electronic products. That is to say, in the production process, the quality of assembly is ultimately reflected in the quality of welding.
in order to inhibit the crosstalk between PCB circuit board wires, in the design of wiring should be as far as possible to avoid long distance equal wiring, as far as possible to open the distance between lines, signal line and ground and power line as fa
Product quality improvement Due to the small size and strong function of chip integrated circuit, one chip integrated circuit can realize the functions of several THT circuits on the SMT circuit board, so the probability of failure of the circuit board is
The designer determines the electrical performance and function of the components in the system structure and detailed circuit design stage, and determines the packaging form and structure of the surface assembled components in the SMT design stage accord
In the high frequency electronic circuit, to prevent electromagnetic radiation is always the concern of designers, the use of metal patch can act as a shield plate, play the role of shielding electromagnetic.
G Handle the ground wire on the printed circuit board, the power cord and ground wire are the most important. To overcome electromagnetic interference, the most important means is grounding.
The output terminals of high-speed CMOS circuits have considerable load capacity, that is, quite large output value. If the output end of a gate is led to the input terminal with quite high input impedance through a very long line, the reflection problem
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