Finally, when carrying out the PCB component layout of the LED switching power supply, it is recommended that engineers arrange the position of each functional circuit unit according to the circuit process, such a layout can make the signal flow more effe
At present, with the development of printed circuit boards to high density and high precision, more stringent requirements are put forward for sulfate copper plating process, and various factors in the copper plating process must be controlled at the same
the chip element is the PCB patch after storage time is too long, generally seven days after the patch needs to be tin, if more than red glue will slowly lose viscosity.
the mobile phone lithium battery peripheral frame is equipped with coils, known as wireless charging lithium batteries. The advantage of this kind of battery is easy to install, but the defect is also obvious, because the mobile phone battery is a metal p
This process has become the mainstream process of cyanide-free copper plating and is widely used by domestic PCB manufacturers. Especially in plastic electroplating, indispensable. It is expected that in a long time, it is difficult to replace other coppe
With the progress of technology in the 1990s, chip integration continued to improve, the number of I/O pins increased sharply, power consumption also increased, and the requirements for integrated circuit packaging were more stringent. In order to meet th
Anti-static SMT loading and unloading rack has been introduced to you before, it is specially used for automatic loading machine, specifications and styles are generally universal.
Packaging refers to the circuit pin on the silicon chip, with a wire connection to the external junction, in order to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips.
In the deposition process, phosphorus is co-deposited with nickel into the coating, and the chemical precipitation of nickel is actually a chemical precipitation of nickel-phosphorus alloy.
In the PCB layout, the power decoupling circuit should be designed near the relevant circuits, rather than placed in the power supply part, otherwise it will affect the bypass effect, and will flow pulsating current on the power line and ground wire, caus
What is the circuit and load impedance? Whether there is space to place magnetic beads on the PCB board. The first three can be judged by observing the impedance frequency curve provided by the manufacturer.
Each PCB board is basically composed of the aperture hole layer, DRILL layer, line layer, solder mask layer, character layer, in the CAM350, each load layer will be separated by a different color, so that we can operate.
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