BGA Reliability ImpactSince flux directly affects electromigration and surface insulation resistance, cleaning is generally required after soldering, but flux cleaning at the bottom of BGA is a very tricky task, so it is recommended to use no-clean flux,
BGA components and their assembly process(1) Visual inspectionFor package arrays such as BGA, without inspection equipment, first visually observe whether the collapse of the outermost solder joints is consistent, and then look at the chip against the lig
FR4 Materials and PropertiesFR4 is a standard for glass fiber reinforced epoxy resin compounds defined by NEMA (National Electrical Manufacturers Association).FR stands for "flame retardant" in English and indicates that the material complies with the UL9
Impedance design of PCB1. Definition of impedance:At a certain frequency, in the transmission signal line of an electronic device, relative to a certain reference layer, the resistance suffered by the high-frequency signal or electromagnetic wave during p
PCB assembly in the medical industryPrinted circuit boards (PCBs) play an important role in healthcare and medicine. As the industry continues to innovate to bring the best technology to patients and their caregivers, more and more research, treatment and
The specific steps and composition of printed circuit board (PCB)With the improvement of microelectronics technology and industrial manufacturing level, printed circuit board (PCB) has become the basic unit of all smart devices and systems. PCB can realiz
PCB AssemblyIn our ongoing series describing the more common problems associated with printed circuit boards, we examine design, assembly, and manufacturing issues. Next, we'll focus on some issues that can affect the board during assembly. While some of
PCB production processThe minimization of all solder joint defects should be the goal of any SMT manufacturer. By understanding defects, their root causes and how to prevent SMT placement defects, you can greatly improve the quality of all the components
In PCB wiring, Stripline circuits can show a good balance between inductive and capacitive coupling, and the forward coupling energy is very small.
Higher signal frequency, steeper edge, smaller printed circuit board size and higher wiring density make the influence of crosstalk in high speed PCB design significantly increase.
The choice of surface treatment process mainly depends on the type of final assembly component; The surface treatment process will affect the production, assembly and ultimate use of PCB. The following details the use of five common surface treatment proc
Demystify the whole process of PCB productionWe have said before that: before the appearance of PCB, the circuit was first composed of point-to-point wiring. Later, winding technology was a major advancement in circuit technology. Later, the electronics i
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