Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
Temperature zone equipment mass production suitable for mass production of PCB board placed on the walkway, to sequence through a number of fixed temperature zones, temperature zone too little will exist temperature jump phenomenon, not suitable for high-
There should be a certain distance between the printed wire and the edge of the PCB (not less than the board thickness), which is not only easy to install and mechanical processing, but also improves the insulation performance.
For amplifiers with push-pull circuit and bridge circuit, attention should be paid to the symmetry of electrical parameters of components and the symmetry of structure when arranging, so that the distribution parameters of symmetrical components are as co
As the product structure of PCB circuit boards is gradually developing to multi-layer and high-precision, PCB board companies should also adapt to The Times, vigorously carry out research in multi-layer board and high-precision board board, in order to ad
It is also necessary to monitor the organic matter content in the silver deposition layer by testing the purity of the silver deposition layer at different time points in the service cycle, and the reasonable silver content should be controlled above 90%
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