SMT SMT processing technology has the advantages of: first, high reliability, strong vibration resistance, second, small size of electronic products, high assembly density, third, high frequency characteristics, reliable performance, four, improve product
The deformation of the circuit board (PCBA board) usually comes from the rapid temperature rise and rapid temperature drop (thermal expansion and cold contraction) caused by Reflow。
As the function requirement of electronic products is higher and higher, the volume requirement is smaller and smaller. In order to meet this need, the welding ball array packaging technology appears.
Take a look at BAG difficult chip repair process, requirements for equipment, personnel: 1, rework requirements for process equipment, 2, components of the temperature requirements, 3, components compatibility, 4, temperature difference Settings, 5, tempe
Significance of PCB cleaning after surface mounting welding: 1. PCB cleaning after surface mounting welding can prevent the occurrence of electrical defects. 2. PCB cleaning after surface mounting and welding can eliminate corrosive substances. 3. The PCB
Virtual welding is a very common line fault, one is in the process of circuit board production, caused by improper production technology, when the unstable state; The other is that after long-term use of electrical appliances, some of the more serious hea
Customers will according to their actual needs to their own trusted electronic processing plant orders, and put forward specific requirements. The processing plant will evaluate its capacity to see if it can fulfill the order.
The functional design requirements of electronic products are higher and higher, but students' requirements for volume are smaller and smaller. This requires the IC chip size to be smaller and smaller, the degree of complexity and enterprises continue to
A total of four BGA were dyed. After the BGA was pulled apart, it could be seen that most of the solder joints were pulled apart from the joint of PCB pad and substrate, and some were pulled apart from the side of pad, but there were holes.
Surface mount for mixed assembly of lead and lead-free BGA1 IntroductionThis SMT lead-free process has been widely used. However, the lead process is still used in military electronics manufacturing, but these components cannot be purchased with lead Lead
PCB processing factory explains the top PCB layout suggestions of BGA packaging, and the latest development of component packaging technology
Kingford is a PCB company engaged in the production and assembly of circuit boards. We not only sell PCBA, but also have many strategies related to PCB design and PCB proofing. Next, let me introduce you to some matters related to PCB.
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