BGA

Explanation of component packaging knowledge

The circuit board manufacturer and circuit board designer will explain the component packaging knowledge to you

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Aging and Deterioration of Solder Joint Strength of PCB

The circuit board is often accidentally damaged during assembly or testing. Even after the PCBA is assembled, it will still be accidentally impacted by external forces. Sometimes even the copper pad on the PCB board is lifted by force and floats away.

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What are the defects of BGA welding

What are the common BGA welding defects? How to handle

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Welding peak temperature and solder paste melting point

Requirements on peak welding temperature and melting point time of solder paste

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Requirements for BGA repair equipment

Requirements of BGA repair equipment and characteristics of the system

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BGA repair method and precautions

In PCBA welding, problems often occur due to BGA welding or SMT chip welding

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Small BGA Rigid Printed Circuit Boards

Kingford supports Small BGA circuit board Small business, we are a professional PCBA one-stop assembly factory, welcome to place an order

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Small Rigid BGA circuit board

We support Small BGA circuit board business, Kingford is a professional one-stop PCBA service factory, Welcome to know about our company.

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Do you undertake BGA rework?

Yes! You can rely on our BGA rework services to ensure optimum performance.

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What is the test for BGA printed circuit board assembly?

For BGA printed circuit board assembly, we have strict testing protocols including: X-ray inspection, functional testing, automated optical inspection.

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What are your BGA assembly capabilities?

Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), L

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What are the factors that affect the quality of BGA assembly?

Some of the factors that affect BGA assembly quality include checking laminate compatibility, warpage requirements, surface finish effects, solder mask clearance, etc.

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