What is BGA assembly?
BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.
BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.
KingFord is a manufacturer specializing in the production of FPGA BGA assembly patch manufacturer. We can provide PCBA with high precision, high density and excellent performance.
kingford provides high-precision Medical motherboard BGA assembly and supporting testing systems. We have sufficient SMT production capacity to ensure customer delivery
We supply Camera module BGA assembly, using dual-channel memory architecture and AMD A68H FCH (Bolton D2H) ,excellent performance, affordable, welcome to consult
The Communication module BGA assembly solution completed by Kingford has reached the best in terms of device performance and stability. Welcome to inquire.
The Consumer Electronics BGA assembly processed and produced by Kingford uses high-quality chips and cameras as the basis of components, Excellent quality at an excellent price
The Industrial control board BGA assemblyed by Kingford is of high quality, and each process in the production process has strict quality testing and standards.
The Huawei 4G communication module BGA assemblyed by Kingford has excellent quality due to advanced processing equipment, welcome to inquire
Amlogic Solution Multimedia Motherboard BGA assembly supplied by Kingford are of the highest quality and superior performance, welcome to inquiry
The high-end projector motherboard PCBA produced by Kingford has HDMI and is of good quality and affordable. Welcome to inquire.
The computer graphics card BGA assemblyed by Kingford is equipped with high-quality electronic components, and can also provide customized services according to customer needs.