the printed circuit board has entered the stage of surface installation and chip installation, and the process requirements are increasing, so the warping requirements of the circuit board are becoming higher and higher. Therefore, we have to find out the
For the fabrication of circuit boards, the more layers, the more complex the process, the higher the failure rate of course, the higher the cost, so the multilayer board can only be used for advanced circuits.
Although the decoupling capacitor can be placed near the through-hole, it is rendered useless at high frequencies due to the lead and through-hole inductance. Such routing will increase the area of signal ring and reduce the current radiation unfavorably.
In the process of high-speed circuit design, we must consider how to deal with the radiation of the power supply and the interference to the whole system. Generally, the area of the power layer plane should be smaller than the area of the ground plane, so
PCB design based on PCB design software can also be regarded as a software development process. Software engineering pays most attention to the idea of "iterative development" to reduce the probability of PCB errors.
The use of direct paving mode is characterized by a strong overcurrent capacity of the pad, for high-power circuit device pins must be used in this way. At the same time, its thermal conductivity is also very strong, although the work is good for the heat
Like this kind of treatment method for those engaged in small household appliances PCB Layout friends are not unfamiliar, so if the amount of tin is uniform enough and the amount of tin is enough, this 1mm wire can be seen as more than a 2mm wire.
pcb board and aluminum base board are designed in accordance with the requirements of pcb board. At present, aluminum base pcb board in the market is generally single-sided aluminum base board, pcb board is a large type, aluminum base board is only a type
The PCB is then placed into the developer to remove unwanted solder masks so that the specified copper foil can be correctly exposed.
For high - level circuit board processing technology research literature, the industry is relatively few. This paper introduces the control points of key production processes, such as material selection, laminated structure design, interlayer alignment, i
According to the laminated structure of the high-rise board and the materials used, study the appropriate pressing procedure, set the best temperature rise rate and curve, in the conventional multi-layer circuit board pressing procedure, properly reduce t
In the high-speed design, we must consider the capacitance of the parasitic parameters, quantitative calculation of the number of decoupling capacitors and the capacity of each capacitor and the specific position of the placement, to ensure that the imped
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