these problems can be avoided. Because the design of the circuit board will vary according to different equipment, different use locations, different heat dissipation requirements, and different electromagnetic interference (EMI) situation, then the desig
As the growth and shrinkage stability of soft plate material is poor, the production of soft plate and pressed PI covering film should be given priority, and the hard plate part should be made according to its growth and shrinkage coefficient.
The main signal line is best concentrated in the center of the PCB board.The clock generator circuit should be near the center of the PCB board, and the clock fan out should be Daisy chain or parallel wiring.
The parasitic capacitance through the hole can cause the signal rise time to be prolonged and the transmission speed to be slowed down, thus deteriorating the signal quality.
Chip products with innovative signal-tuning technologies, such as high-speed backplane interface solutions, can effectively solve these system-level challenges, enabling system vendors to deliver high-performance and scalable systems to their customers, w
There is no denying that current industry trends and consumer demands are pushing designers and design teams to push the envelope and develop new electronic products to meet market challenges.
The current approach is to increase the distance between the two signal layers and make the lines of the two layers as vertical as possible to avoid signal crosstalk between layers.
With the combination of soft and hard technology, designers can interconnect multiple PCBS in a single package without the need for connectors, wires and cables.
This simple statement connects the common sense of capacitance with the newly discovered theory of characteristic impedance.
Many customers use pad(plug-in holes) to represent conductive holes, thus causing your conductive holes to open the window. Then please check your document design!
In the real world, in addition to considering signal quality, power source plane coupling (using adjacent ground planes to reduce AC impedance of the power plane) and layered symmetry are all factors to be considered.
When selecting the driver chip, in addition to ensuring that it basically matches the load and that the signal edge meets the requirements (generally, the clock is an effective signal along the clock), the time delay of the clock in the driver chip should
Telegram