Interference analysis and countermeasure in high frequency PCB design
In PCB, there are only two kinds of transmission lines: strip line and microwave line. The biggest problem of transmission line is reflection, which will cause many problems.
In PCB, there are only two kinds of transmission lines: strip line and microwave line. The biggest problem of transmission line is reflection, which will cause many problems.
In circuit board design, the thickness, through hole process and the number of layers of circuit board are not the key to solve the problem. Good layered stacking is the key to ensure the bypass and decoupling of the power busbar, to minimize the transien
In a high speed PCB, wiring is more than just connecting two points. As a qualified engineer, wiring is a hybrid knowledge carrier including resistance, capacitance and inductance.
Starting from the most basic PCB board, this paper discusses the function and design skills of PCB stacking in controlling EMI radiation.
In terms of PCB design, 50 ohm is also selected after comprehensive consideration. In terms of PCB wiring performance, generally low impedance is better.
With the development of large-scale integrated circuit and super-large scale integrated circuit, the multilayer printed board (PCB) will be used more and more.
The circuit working at high frequency should consider the interference between components. The general circuit should make parallel arrangement of components as far as possible to facilitate wiring;
The microstrip line consists of a fixed length of metal or wire and the whole or part of the ground plane located directly below it.
Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.
Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short
In the actual application, according to the application needs to determine whether ESD shielding is needed, when the FPC flexibility requirements are not high, solid copper, thick medium can be used to achieve.
According to experience, the effect of RF circuit not only depends on the performance of the RF circuit board itself, but also depends on the interaction with the CPU processing board.