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Questions and Answers about experience sharing in high frequency PCB circuit design

one is that two lines walk on the same layer (side-by-side), the other is that two lines walk on two adjacent layers (over-under). Generally, there are many ways to implement the former side-by-side.

Design performance requirements of PCB multi-substrate

In order to minimize the chance of PCB board distortion and obtain a flat finished board, the layering of the multi-substrate board should be kept symmetrical.

High speed PCB design

The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.

Design of controllability and electromagnetic compatibility of high speed PCB

There is a little bit of short circuiting between digital and analog, but note that there is only one connection point. There are also differences on the PCB, which is determined by the system design.

Methods of eliminating crosstalk in PCB design

The size of inductive crosstalk depends on the proximity of two loops, the size of the loop area, and the impedance of the load affected.

There are several ways to eliminate crosstalk in PCB design coupling

High speed devices are particularly sensitive to this, and will thus receive high speed false signals, while low speed devices will ignore such false signals.

PCB hole design tips to share

In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.

The change of circuit board material with temperature will lead to the change of design Dk and phase Angle

Although both microstrip line and GCPW can be modeled and simulated to predict circuit performance, GCPW is more difficult to process and affected by processing at 77GHz frequency.

Why are PCB design layers mostly even?

the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.

Understand PCB laminated design

It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.

A set of hardware devices designed and manufactured

to produce a conductive channel on the circuit board that allows the later process to complete the connection between the upper/lower or intermediate circuit layers

Install PCB circuit board anti-ESD design

In order to eliminate electrostatic discharge (ESD) interference and damage to electronic equipment, it is necessary to take a variety of technical measures to prevent.

Just upload Gerber files, BOM files and design files, and the KINGFORD team will provide a complete quotation within 24h.