When selecting the driver chip, in addition to ensuring that it basically matches the load and that the signal edge meets the requirements (generally, the clock is an effective signal along the clock), the time delay of the clock in the driver chip should
one is that two lines walk on the same layer (side-by-side), the other is that two lines walk on two adjacent layers (over-under). Generally, there are many ways to implement the former side-by-side.
In order to minimize the chance of PCB board distortion and obtain a flat finished board, the layering of the multi-substrate board should be kept symmetrical.
The main reason of reflection signal: too long running; Transmission lines with unmatched terminations, excess capacitance or inductance, and impedance mismatches.
There is a little bit of short circuiting between digital and analog, but note that there is only one connection point. There are also differences on the PCB, which is determined by the system design.
The size of inductive crosstalk depends on the proximity of two loops, the size of the loop area, and the impedance of the load affected.
High speed devices are particularly sensitive to this, and will thus receive high speed false signals, while low speed devices will ignore such false signals.
In particular, note that the bypass capacitor needs to pass through two holes when connecting the power layer to the formation, so that the parasitic inductance of the holes will be multiplied.
Although both microstrip line and GCPW can be modeled and simulated to predict circuit performance, GCPW is more difficult to process and affected by processing at 77GHz frequency.
the following methods can be used to balance the cascade, reduce the cost of PCB production and avoid PCB bending.
It is important to note that the power layer should be near the layer that is not the main component plane, because the bottom plane will be more complete. Therefore, EMI performance is better than the first scheme.
to produce a conductive channel on the circuit board that allows the later process to complete the connection between the upper/lower or intermediate circuit layers
