PCB etching process
In PCB board production, only two steps will use film stripping. D/F stripping after etching of the inner line and D/F stripping before etching of the outer line (if the outer line is made into a negative film process).
In PCB board production, only two steps will use film stripping. D/F stripping after etching of the inner line and D/F stripping before etching of the outer line (if the outer line is made into a negative film process).
By using SMT, the PCB does not need to be drilled into it. Instead, what they do is they use solder paste. In addition to adding a lot of speed, this simplifies the process significantly.
Effective techniques to improve PCB design spread rate and design efficiency: first, PCB board size and wiring layer number need to be determined in the early design, second, automatic wiring tool itself does not know what should be done, third, in the la
Considering the performance and processing efficiency of PCB, the preferred process sequence is as follows: 1. If the component surface is mounted on one side, it is formed by reflow welding; 2. 2. If the component surface patch and plug-in are mixed: one
The PCB process design requirements are introduced in detail: 1, test point addition, 2, optical location point, 3, add working edge, 4, film file output, 5, plate rules, 6, board information annotation
Common pads are: 1, square pad, 2, round pad, 3, island pad, 4, polygonal pad, 5, oval pad, 6, open shape pad
We should not only master various maintenance methods and analysis methods, but also learn and use them flexibly. To be calm, to work hard, to guard against arrogance and impetuous, to maintain a common heart, to make a difference.
PCB design impedance matching: PCB design impedance matching refers to a suitable collocation between the signal source or transmission line and the load. According to the access mode PCB design impedance matching has serial and parallel two ways; Accordi
First, clean the cured photosensitive film on the PCB. It is then cleaned of excess copper foil covered with a strong alkali. The tin coating on PCB layout copper foil is then removed with destin solution. After cleaning, complete the 4-layer PCB layout.
Polygon filling deviation usually occurs when polygon plating copper on multi-grid circuit boards. While it does not have a standard based on a single grid, it can provide service beyond the required life of the boards.
PCB board depends on science and technology, naturally must not lag behind, so the layout of high frequency PCB has become the key point to discuss when we design PCB high frequency board.
PCBA proofing operation process :1. Customers place orders; 2. Customers provide production materials; 3. Purchased raw materials, 4. Incoming material inspection, 5. PCBA production, 6. PCBA testing, 7. After packaging