SMT factory layout and location requirements: 1, fire extinguisher placement area, 2, material rack car placement area, 3, material preparation table placement area, 4, printing station table placement area, 5, tin paste placement area, 6, after the furna
Preliminary work to be done before PCB design :1, determine the number of PCB layers, 2, PCB design rules and restrictions, 3, component layout
Spacing is more important in high voltage designs because the voltage across the board components makes arcing between the two conducting components more likely to occur on your PCB. Any electric arcs that do occur pose a higher risk to both the product a
PCBA contracted work and materials matters needing attention :1. Circuit design; 2. Selection of materials; 3. Selection of PCBA factory
The PCB board where the component is placed is placed into the machine from one end. On a double-track conveyor belt, the circuit board of the newly placed component passes through the hot and cold zones of the reflow furnace, precisely controlling the me
How to do electromagnetic compatibility design :1. Suitable wire width,2. Key points of component wiring,3. Wiring rules for high frequency and high speed signals
The effect of horizontal perforation electroplating in machining multilayer circuit boards is far inferior to that of vertical perforation electroplating.
SMT SMT processing technology has the advantages of: first, high reliability, strong vibration resistance, second, small size of electronic products, high assembly density, third, high frequency characteristics, reliable performance, four, improve product
With the high density interconnection design of PCB board and the progress of electronic technology, carbon dioxide laser processing equipment has become an important tool for PCB board manufacturers to process microholes.
OSP is Organic Solderability Preservatives, which refers to the coating of OSP film on the bare brass plate (double-sided/multilayer/two-layer) in place of the original protective treatment such as tin spraying on the surface of the plate.
The high-speed digital signal is determined by the edge speed of the signal. It is generally believed that the rise time is less than 4 times the signal transmission delay can be regarded as high-speed signal.
When wiring the printed board, the position of the components on the board should be determined first, and then the ground wire and power cord should be distributed. When arranging high speed signal lines, it is best to consider low speed signal lines.
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