The OSP acts as a barrier between the copper and the air. Simply put, it chemically grows an organic film on a clean, bare copper surface. The only function of this organic film is to ensure that the inner copper foil does not oxidize before welding.
Field observation is a practical investigation method, which is of great reference significance for the internal self-understanding and improvement of PCB manufacturers, as well as the understanding and selection of suppliers.
There are three main types of metal substrate: aluminum substrate, copper substrate, iron substrate. Iron substrate is rarely used in the market, here the focus of analysis is aluminum substrate, copper substrate.
In PCB design, wiring is an important step to complete the product design, it can be said that the previous preparatory work is done for it, in the whole PCB, the wiring design process to limit the highest, the most fine skills, the largest workload.
The role of PCB board is not only to combine scattered components, but also to ensure the regularity of circuit design, a good way to avoid the chaos and error caused by manual wiring and wiring.
Industrial circuit boards should pay attention to heat dissipation problems; The second is printed board copper foil line, poor quality circuit board power supply line copper foil is very thin, easy to burn due to the current.
In PCB design, wiring is an important step to complete the product design, it can be said that the previous preparation work is done for it. PCB routing includes single - sided routing, double - sided routing and multi - layer routing.
Almost all PCB design software includes a tool called an autocabler, but the autocabler never does the wiring for itself.
The purpose of thawing back temperature: can make the flux and tin powder evenly distributed, so as to give full play to the various characteristics of tin paste; The viscosity and activity of the solder paste after refrigeration are different from that o
PCBA processing and welding process requirements for PCB board: 1. Heat resistance, 2. PCB shape, 3. PCB size, 5. PCB process edge, 6. PCB reference identification point, 7. Plate design, 8, can withstand solvent washing
PCB inspection contents: ① appearance inspection: ② size measurement: ③ furnace temperature test: ④ pad welding force test: ⑤ Check the PCB board factory report
When the welding ends or pins of components are oxidized or contaminated, welding defects such as poor wetting, virtual welding and voids will occur in reflow welding. Poor coplanar properties of components will also lead to welding defects such as virtua
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